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IMAC LIQUID DAMAGE INSPECTION

IMAC LIQUID DAMAGE INSPECTION

R338.43

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At our soldering laboratories we can carry out complicated component recovery procedures, such as BGA reballing. During this repair process the component is de-soldered of the board, all original solder is removed and IC is reballed using higher quality, more reliable solder. The environment during this procedure has to be next to clean room and soldering profiles developed keeping heat cycles, flux, lead solder and component age in mind. Soldering laboratories within IGadgett facilities are ESD-safe, temperature controlled and humidity monitored to make sure our procedures are within IPC/JEDEC standards. Our specialist repair centre can carry out any iMac repair procedure. We have over 10 years experience in troubleshooting and fault finding Apple equipment. Whilst maintaining large inventory of parts and specialised equipment we are able to carry out all iMac repairs, including component level logic board repairs, quickly and affordably to ensure our customers downtime is reduced to minimum.